DP-F1500L是一款无基材超薄型缝隙填充导热垫片，产品厚度小于1mm，其导热系数可达1.3 W/mK，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。DP-F1500L适用于空间较小的发热元器件领域，且具有自粘性，不需要额外涂覆粘胶涂层。

DP-F1500L is a no substrate, ultra-thin thermal material rated at a thermal conductivity of 1.3 W/mK, low thermal resistances can be achieved at low pressures and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. DP-F1500L is applied to heating units in narrow space, and is naturally tacky, and no adhesive coating is required.

半导体散热装置Semiconductors to heat sink

通讯设备 Telecommunications equipment

显卡Graphics cards

记忆存储模块 Memory modules

照明设备 LED solid state lighting LED

台式电脑，笔记本电脑，网络服务器 Desktop computers, laptops, servers

电源设备 Power electronics

LCD和等离子电视 LCLCD and PDP flat panel TV

热传导率可达1.3 W/mKThermal Conductivity 1.3W/mK

超薄型Ultra-thin

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能Excellent adhesive properties