DP-F1000是一款柔软且具有高形变回复率的缝隙填充导热垫片，其导热系数可达1.0W/mK，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。

The high rate of compliancy and softer of DP-F1000 is a thermal conductivity of 1.2 W/mK. It is ultra-soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

半导体散热装置 Semiconductors to heat sink

通讯设备 Telecommunications equipment

显卡 Graphics cards

记忆存储模块 Memory modules

LED 照明设备 LED solid state lighting

电源设备 Power electronics

LCD和等离子电视 LCD and PDP flat panel TV

热传导率可达1.0W/mK
Thermal Conductivity 1.0W/mK

热传导率可达1.0W/mK
Thermal Conductivity 1.0W/mK

热传导率可达1.0W/mK
Thermal Conductivity 1.0W/mK

热传导率可达1.0W/mK
Thermal Conductivity 1.0W/mK