DP-F2000L是一款高导热无基材超薄型缝隙填充导热垫片，产品厚度小于1mm，其导热系数可达1.8W/mK，可适用于排除各类狭小空间元器件和电路板之间的空气，并且充分填充各类粗糙的表面。同时，DP-F2000L具有表面黏性，并可根据实际要求裁切为所需形状，易于操作。

DP-F1500L is a no-substrate, ultra-thin thermal material rated at a thermal conductivity of 1.8 W/mK, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. DP-F2000L is naturally tacky, and easily handles for converting with varied sharp.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

记忆存储模块Memory modules

照明设备LED solid state lighting LED

台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers

电源设备Power electronics

LCD和等离子电视 LCLCD and PDP flat panel TV

热传导率可达1.8 W/mK Thermal Conductivity 1.8W/mK

低压力下就有较低的热阻Ultra-thin 超薄型 u Low thermal resistance at low pressure

优异的自粘性能Excellent adhesive properties