DP-F1200是一款高形变回复率的缝隙填充导热垫片，其导热系数可达1.2 W/mK。因为其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。DP-F1200具有自粘性，不需要额外涂覆粘胶涂层。

The high rate of compliancy of DP-F1200 is a thermal conductivity of 1.2 W/mK. It is ultra-soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. DP-F1200 is naturally tacky, and no adhesive coating is required.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules

LED 照明设备LED solid state lighting

电源设备Power electronics

LCD和等离子电视LCD and PDP flat panel TV

热传导率可达1.2W/mKThermal Conductivity 1.2W/mK

广泛应用于低压力情况下Designed for low-stress applications

优异的自粘性能Excellent adhesive properties

多种满足客户需要的产品，如DC1系列和玻纤增强系列Varied application products for customer which is DC1 series and with fiber-glass series