导热垫片 DP-F8000
产品介绍DESCRIPTION
DP-F8000 是一款高导热性能且低硬度的缝 隙填充导热垫片,该产品导热系数可达 到 8 W/mK,并且可在低压力下保持优良 的导热性能。同时,该产品具有弹性体所 固有的填充特性,适用于各种粗糙表面。 DP-F8000 具有自粘性,无需额外涂覆其 他粘结涂层,操作方便。
DP-F8000 is a thermally conductive, reinforced material rated at a thermal conductivity of about 8.0 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. DP-F8000 is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process.
注:缝隙垫可根据需要进行单面无粘性处 理或双面无粘性处理。非粘性处理的单面或双面均有软性保护衬垫。
典型应用APPLICATIONS
半导体散热装置Semiconductors to heat sink
通讯设备Telecommunications equipment
显卡Graphics cards
记忆存储模块Memory modules 记忆存储模块
LED 照明设备 LED solid state lighting LED 照明设备
电源设备Power electronics 电源设备
LCD和等离子电视 LCLCD and PDP flat panel TV
特点与优势FEATURES AND BENEFITS
热传导率可达8 W/mKThermal Conductivity 6W/mK
高柔顺性Soft and highly Compliant
低压力下就有较低的热阻Low thermal resistance at low pressure
优异的自粘性能,便于装配Naturally tacky for easy assembly