产品介绍DESCRIPTION

       DP-F9000 是一款高导热性能且较低硬度的 缝隙填充导热垫片，该产品导热系数可达 到 9 W/mK，并且可在低压力下保持优良 的导热性能。同时，该产品具有弹性体所 固有的填充特性，适用于各种粗糙表面。 DP-F9000 具有自粘性，无需额外涂覆其他 粘结涂层，操作方便。

       DP-F9000 is a thermally conductive,  reinforced material rated at a thermal  conductivity of about 9.0 W/mK, low  thermal resistances can be achieved at low  pressures. This soft interface pad conforms  well to minimal pressure, resulting in  excellent interfacing and wet-out  characteristics, even to surfaces with high  roughness and/or topography.  DP-F9000 is naturally tacky, and no  adhesive coating is required, to provide  easy handling and converting process.

注：缝隙垫可根据需要进行单面无粘性处 理或双面无粘性处理。非粘性处理的单面或双面均有软性保护衬垫。

典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules 记忆存储模块

LED 照明设备 LED solid state lighting LED 照明设备

电源设备Power electronics 电源设备

LCD和等离子电视 LCLCD and PDP flat panel TV

特点与优势FEATURES AND BENEFITS

热传导率可达9 W/mKThermal Conductivity 6W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly