产品介绍DESCRIPTION

      DP-F2000SB 是一款质软型缝隙填充导热垫片，因其具有较小的硬度，可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分润湿填充各类粗糙的表面。

       DP-F2000SB is a soft gap-filled thermally conductive gasket. Because of its small hardness, it can exhibit a small thermal resistance under low pressure, and at the same time eliminate the air between the components and the circuit board. And fully wet and fill all kinds of rough surfaces.

注：缝隙垫可根据需要进行单面无粘性处 理或双面无粘性处理。非粘性处理的单面或双面均有软性保护衬垫。

典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules 记忆存储模块

LED 照明设备 LED solid state lighting LED 照明设备

电源设备Power electronics 电源设备

LCD和等离子电视 LCLCD and PDP flat panel TV

特点与优势FEATURES AND BENEFITS

热传导率可达2.9 W/mKThermal Conductivity 2.9W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly