产品介绍DESCRIPTION

      DP-F3000CLB 是一款缝隙填充导热垫片，该产品的导热系数可达到 3.0 W/mK，并能在低压力的情况下表现出较小的热阻。同时，该产品较为柔软，可充分填充各类表面粗糙度的电子元器件。

       DP-F3000CLB is a gap-filled thermally conductive gasket. The thermal conductivity of this product can reach 3.0 W/mK, and it can show smaller thermal resistance under low pressure. At the same time, the product is relatively soft and can fully fill electronic components with various surface roughness.

注：缝隙垫可根据需要进行单面无粘性处 理或双面无粘性处理。非粘性处理的单面或双面均有软性保护衬垫。

典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules 记忆存储模块

LED 照明设备 LED solid state lighting LED 照明设备

电源设备Power electronics 电源设备

LCD和等离子电视 LCLCD and PDP flat panel TV

特点与优势FEATURES AND BENEFITS

热传导率可达3.0 W/mKThermal Conductivity3.0W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly