导热垫片 DP-F8000LV
产品介绍DESCRIPTION
DP-F8000LV 是款低挥发型高导热性能且质软的缝隙填充导热垫片,该产品导热系数可达8.0w/m-k,并且可在低压力下保持优良的导热性能。同时,产品具有无挥发的特性,可以用于对低分子物质敏感的部位。可应用在光源、镜头、监控设备等需导热的场合。
DP-F8000LV is a low-volatility, high thermal conductivity and soft gap-filled thermal pad. The thermal conductivity of this product can reach 8.0w/m-k, and it can maintain excellent thermal conductivity under low pressure. At the same time, the product has non-volatile characteristics and can be used in parts sensitive to low-molecular-weight substances. It can be used in light sources, lenses, monitoring equipment and other occasions that require heat conduction.
注:缝隙垫可根据需要进行单面无粘性处 理或双面无粘性处理。非粘性处理的单面或双面均有软性保护衬垫。
典型应用APPLICATIONS
半导体散热装置Semiconductors to heat sink
通讯设备Telecommunications equipment
显卡Graphics cards
记忆存储模块Memory modules 记忆存储模块
LED 照明设备 LED solid state lighting LED 照明设备
电源设备Power electronics 电源设备
LCD和等离子电视 LCLCD and PDP flat panel TV
特点与优势FEATURES AND BENEFITS
热传导率可达8.0 W/mKThermal Conductivity8.0W/mK
高柔顺性Soft and highly Compliant
低压力下就有较低的热阻Low thermal resistance at low pressure
优异的自粘性能,便于装配Naturally tacky for easy assembly