DP-F2500是一款质软型缝隙填充导热垫片，由于其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面，操作简便，可重复利用。

DP-F2500 is recommended for low-stress applications that require a high thermally conductive interface material. It is ultra-soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack up tolerances. Naturally tacky, it requires additional adhesive coating by the actual condition.

半导体散热装置Semiconductors to heat sink

照明设备LED solid state lighting LED

台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers

LCD 和等离子电视LCD and PDP flat panel TV

热传导率可达2.6W/mKThermal Conductivity 2.6W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly

便于操作，可重复利用Easy handling and converting process, reusable special property.