DP-P1500是一款质软型缝隙填充导热垫片，由于其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。DP-P1500具有自粘性，不需要额外涂覆粘胶涂层，同时操作简便，可重复利用。

DB-P1500 is soft thermal pad for low thermal resistance at very low pressures. And it allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. DB-P800 is naturally tacky for reuse, and can be coated the adhesive thing is required.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

记忆存储模块Graphics cards 显卡 u Memory modules

LED 照明设备LED solid state lighting

台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers

电源设备Power electronics

热传导率可达1.5 W/mKThermal Conductivity 1.5W/mK

广泛应用于低压力情况下Designed for low-stress applications

优异的自粘性能Excellent adhesive properties

便于操作，可重复利用Easy handling and converting process, reusable special property.